![]() ![]() At the same time, thermal properties of graphene flakes in the composites will be determined by the flake size, thickness, and coupling to the matrix material. It was discovered that the intrinsic thermal conductivity of graphene is extremely high. Theoretical and cost considerations suggest that chemically derived graphene and few-layer graphene (FLG) flakes can perform better than other carbon materials in TIMs. ![]() Carbon materials such as carbon nanotubes (CNTs) have been studied as possible fillers in TIMs. Current TIMs are based on polymers or greases filled with thermally conductive particles such as silver or silica, which require high volume fractions of filler (up to 70%) to achieve K of ~1-5 W/mK of the composite. Efficient thermal management of electronics, optoelectronics and photonic devices require better thermal interface materials (TIMs). ![]() ![]() In such a situation, the search for materials that conducts heat well and fast became essential for design of the next generations of integrated circuits (ICs) and three-dimensional (3D) electronics. The power dissipated in computer chips has been growing with each new technology node reaching unsustainable levels. ![]()
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